Super Steam Generator / Heat Beam Cylinder
(High efficient compact heat exchanger)

Test Wafer

Business Concept

Philtech was founded in May, 2001 by Yuji Furumura and his partners. The starting capital of Philtech at the founding was \20,000,000 JPY and had its first company site located in Tokyo, Chiyoda-ku.
In August, Philtech was appointed by the Association of Super-advanced Electronics Technology (ASET) as the representative for X-ray photolithography wafer development. A year later in November, 2002, Philtech managed to launch the world's first commercial 300mm x-ray patterned wafers and related services.
Following the achievements, in late 2004 Philtech was granted a subsidy by the New Energy and Industrial Technology Development Organization (NEDO) and started its launch on rf-powder chip development.
A month later in January 2005, Philtech launched the world's first commercial 300-mm charge-up monitor TEG wafers (YST).
Philtech's total capital had then expanded to over 1800% of its starting capital to \350,927,500 JPY in March (2006). Philtech was then once again granted a subsidy by NEDO which allowed the launch of rf-temperature measurement system development in 2009 and had its company location changed to the University of Tokyo at the end of the year for joint developments with the university.

Philtech completed its development on Heat-Beam CVD in August 2012. This device is capable of growing crystal film quickly without the need of interruptions as it does not require an artificial atmosphere to grow crystal film. Furthermore, the device is not bound by limitations of substrate sizes; it is possible to process an endless supply of substrate. Along with the Heat Beam CVD, Philtech developed several versions of the device to fit multiple industries' needs.

The semiconductor industry has continuously invested a large amount of capital during its growth from the 60s. During this time, Philtech's current board and product developers were actively involved in this industry's growth and accumulated important know-how of the industry. Equipped with this knowledge, Philtech was able to develop state of the art test-wafers and succeeded in penetrating the test-wafer market through their innovativeness. However, as the technology became more widespread, the low-cost manufacturing countries quickly became a major threat due to their production capabilities. In a response, Philtech changed its philosophy to gthinking out of the box"; instead of focusing on R&D on existing technology, Philtech aims to be different by developing new products with a different approach for existing markets. Its current vision lies in improving the world's ecology, which is why its recent product developments are aimed at at improving renewable energy sources and waste recycling for the next generation.

Philtech will continue to strive for technological innovations with an out of the box mindset while incorporating affordability, pro-nature, precision and customizability for each customer's needs.