Corporate Information

Building Bridges to Tomorrow’s Technology

Philtech’s products have been globally recognized over the long term.
These technology offerings represent our expertise
and will continue to contribute to the development of growing markets.

Greetings

We, Philtech, support your technical development in semiconductor technology through our test wafer services. Our services include bare Si wafers,
coated wafers, patterned wafers, and more.
We also provide wafer services for evaluating charge-up damage, which are available even for 12-inch wafers
and have been globally recognized over the long term.
We also offer technologies derived from semiconductor manufacturing to the market.
These technology offerings represent our expertise
and contribute to the development of growing markets.

Yūji Furumura President & CEO”

Mission Statement and Business Strategy

Mission Statement

Philtech serves products that are generated from intellectual property inherent in dedicated member. Philtech aims a company that reward those member according to their contribution.

Business Strategy

  • We, Philtech, supply test wafers that express knowledge and expertise dedicated member Obtained through their development　experience in semiconductor manufacturing.
  • We connect global semiconductor infrastructures to serve our products.
  • We will develop new business region using Heat-Beam Cylinder that is a highly effective heat exchanger developed as a derivative technology of semiconductor manufacturing.

Our main services

Test wafer（TEG）solution services
  • Bare Silicon Wafer
  • Blanket film Wafer
  • Charge-Up Monitor Wafer
  • Patterned Wafer
  • Custom Design Patterned Wafer
  • CMP Evaluation Wafer
  • Assembly Evaluation Wafer
  • MEMS Processed Wafer
Heat exchanger (Heat Beam Cylinder)
  • Heat Beam Cylinder (Gas Heat Exchanger, Super Steam Generator)
  • Heat Beam Equipped CVD Tool, H2 Generator
Consulting service
  • Support for Renewable Energy Introduction
  • High temperature CVD-tool for crystal growth

About us

Company Name

Philtech Inc.

Founded

May 21, 2001

Representative

Yūji Furumura President & CEO（Personal history）
CEO Yuji Furumura

Capital

100,000,000 JPY

Major Shareholders

Yuji Furumura （CEO）

Philbridge Inc.

ATC Co.,Ltd.

Major Banks

Resona Bank, Ltd.

MUFG Bank, Ltd.

Kiraboshi Bank, Ltd.

Japan Finance Corp.

The Shoko Chukin Bank, Ltd.

The Higashi-Nippon Bank, Limited

Boards

CEO Yuji　Furumura
Director Shinji　Nishihara
Director Takeo Suzuki
Director Masaro Fujinuma
Director Mutsunori Sano
Auditor Yoshifumi Kawamoto

Corporate History

May 2001 Establishment of Philtech Co., Ltd. with a capital of 20 million yen.
Headquarters located at 2-5-7 Hirakawa-cho, Chiyoda-ku, Tokyo.
August 2001 stablishment of a consortium utilizing the proximity X-ray lithoglaphy equipment (PXL) developed by ASET, with Philtech as the representative.
November 2002 Commencement of supply and utilization services for the world’s first 300mm X-ray lithoglaphy wafers.
November 2003 Increase in capital to 175 million yen.
July 2004 Increase in capital to 258 million yen.
December 2004 Adoption of the Industrial Technology Practical Development Grant for the fiscal year 2004 by NEDO,
initiating the development of RF powder chips.
January 2005 Commencement of market sales for the world’s first 300mm charge-up measurement wafers.
December 2005 Relocation of headquarters to 4-3-4 Kojimachi, Chiyoda-ku, Tokyo.
March 2006 Increase in capital to 350.92 million yen.
March 2009 Adoption of the NEDO Industrial Technology Practical Development Grant for the fiscal year 2008,
initiating the development of RF temperature measurement systems.
October 2009 Relocation of headquarters to 2-11-16 Takeda Advanced Knowledge Plaza, Yayoi, Bunkyo-ku, Tokyo.
August 2012 Successful announcement of the development of a heat beam device capable of growing crystal films on
an infinite continuous substrate in atmospheric conditions.
September 2012 Relocation of headquarters to 7-3-1 Entrepreneur Plaza, University of Tokyo, Hongo, Bunkyo-ku, Tokyo.
August 2015 Relocation of headquarters to 2-29-3 Yushima Ota Building 5th floor, Bunkyo-ku, Tokyo.
September 2022 Relocation of headquarters to 1-8-7 Iino Building 7th floor, Kameido, Koto-ku, Tokyo.
October 2022 Reduction of capital to 100 million yen.

Location・Access

Head office

7F Iino Bldg. 1-8-7 Kameido, Koto-ku, Tokyo　136-0071 Japan
TEL: +81-3-5875-0626　FAX: +81-3-5875-0726

Fuchu Laboratory

1-5-14 102 Ikesho-Bldg., Sakae-cho, Fuchu-City,
Tokyo, 183-0051 Japan