This is a patterned wafer for evaluating CMP polishing rate, erosion, dishing, and selectivity.
CMP Evaluation Wafers
CMP Evaluation Wafers
1. Cu-CMP Evaluation Wafer
754 pattern wafer after Cu plating
Please let us know your preferences regarding the insulating film material, film thickness, and Cu plating film thickness.
2. STI&CMP Evaluation Wafer
Overview of PT004 Pattern
PT004 is a patterned wafer designed primarily for STI's buried oxide film CMP evaluation. Therefore, PT004 is equipped with patterns with varying trench dimensions and pattern densities.
Please contact us regarding your structural requests.
Cross-Sectional SEM image (PT004)
After STI processing before embedding oxide film