Used for coverage evaluation of film deposition equipment such as CVD, PVD, and ALD.
Examples of patterned wafers we have are shown below.
We also have other patterned wafers, so please contact us for details.
Trench Pattern Wafers
Trench Pattern Wafers
1. 200mm Trench Patterned Wafer（Mask Name: PT063）
・Wafer size: 200mm
・Trench mask dimensions: 0.2um to 10um
・Trench length: 3.5mm
・Chip size: 16mm x 16mm
・Trench patterns with different trench widths and pattern densities are arranged in each sub-chip group.
・Silicon processed wafer using Bosch etching.
We use Bosch etching, which is suitable for deep etching of silicon. The pattern is formed with the aim of increasing the ratio between trench width and silicon depth (aspect ratio).
We can provide both 200mm wafer and diced chips.
PT063 chip layout image
Cross-sectional SEM image of
0.2um width pattern (mask dimension)
Depth: 17.0um
Cross-sectional SEM image of
5.0um width pattern (mask dimension)
Depth: 51.5um
2. 6inch Trench Patterned Wafer
・Wafer size: 150mm
・Trench mask dimensions: 0.5um, 1um, 2um
・Silicon processed wafer using non-Bosch etching.
Width: 0.5 um, Depth: 5.2 um / Width: 1 um, Depth: 6.5 um
This is a pattern in which silicon is deeply etched using non-Bosch etching. Although the ratio of trench width to silicon depth (aspect ratio) is not large, there is no scalloping on the side of the hole that occurs with Bosch etching.
Width: 2 um, Depth: 7.6 um