Sizes, request conditions, and delivery

Wafer sizes

4-inch (100 mm), 6-inch (150 mm), 8-inch (200 mm), 12-inch (300 mm), and others
Contact us about smaller-diameter wafers, other sizes, and chips.

Customer-supplied wafers

Processing of customer-supplied wafers can also be discussed.

Inspection and measurement

On request, we perform film thickness measurements, visual inspection, and cross-sectional SEM imaging. The scope is confirmed for each request.

Delivery

Processed wafers or chips are shipped in wafer cases or other suitable packaging.

Typical applications

Wafers can be used for materials, process, and equipment evaluation, as well as handling, calibration, and inspection. TEG and MEMS prototyping can also be discussed.

Examples of processes and methods available for consultation

Design and masks

Pattern design (including TEGs), GDS layout preparation, photomask production, and more

Deposition and plating

Thermal oxidation, vapor-phase deposition (CVD, ALD, sputtering, and evaporation), coating, plating (bump and interconnect formation), and more

Pattern fabrication

Photolithography and lift-off
Dry etching (including deep silicon etching), anisotropic wet etching of silicon, and more
Silicon machining (blasting, laser processing, and more)

Cleaning and surface treatment

Cleaning, resist removal (ashing and other methods), plasma surface treatment, and more

Heat treatment and ion implantation

Heat treatment (annealing), ion implantation, and more

Polishing, cutting, and bonding

CMP, backside grinding (backgrinding), dicing, wafer bonding, and more

We confirm the available conditions for each combination of material, size, and process.

Substrate options

Wafer sizes

2-inch (50 mm), 4-inch (100 mm), 5-inch (125 mm), 6-inch (150 mm), 8-inch (200 mm), 12-inch (300 mm), and others
Contact us about smaller-diameter wafers and other sizes.

Material

Single-crystal silicon

Silicon wafer types

CZ (MCZ) wafers, FZ wafers, high-resistivity wafers, low-resistivity wafers, particle monitor wafers, lithography wafers, epitaxial wafers, annealed wafers, thin wafers, recessed wafers, strip wafers, coinroll wafers, and others

Other substrates

SOI, quartz, SiC, SiGe, sapphire, GaN, LT (lithium tantalate), and LN (lithium niobate)

Crystal and electrical specifications

Crystal orientation, P-type/N-type, dopant, and resistivity

Thickness and polishing specifications

Specified substrate thickness, single-side polishing, and double-side polishing

Surface control

Particle level and COP

Flatness

SFQR, TTV, Bow, Warp

Applicable standards

Specifications based on SEMI and JEITA standards

Wafer carriers (25 wafers)

FOSB/FOUP for 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch wafers

Wafer shippers (single-wafer)

6-inch, 8-inch, and 12-inch

Chip cases

Available

Gusset bags for FOSB

Clear bags (inner bags) and Al bags (outer bags)

Typical applications

Photolithography, particle monitoring, deposition, dummy wafer use, handling, and back-end processing

Film types and deposition methods

Wafer sizes

4-inch (100 mm), 6-inch (150 mm), 8-inch (200 mm), 12-inch (300 mm), and others
Contact us about smaller-diameter wafers, other sizes, and chips.

Compatible substrates

In addition to silicon wafers, we support compound semiconductor wafers, quartz and glass substrates, ceramics, chips, rectangular substrates, and others.

Th-SiO2: thermal oxide; Poly-Si: polycrystalline silicon; α-Si (a-Si): amorphous silicon; α-C: amorphous carbon; SoC: spin-on carbon.

PVD: sputtering, evaporation, ion plating, and other methods. PECVD: plasma-enhanced CVD; LPCVD: low-pressure CVD; ALD: atomic layer deposition.

In addition to blanket plating, we support patterned plating for bumps, interconnects, pads, and other features.

Vacuum evaporation, electron-beam evaporation, and electroless plating can also be discussed. Combinations of film type and processing conditions are confirmed individually.

Feasibility depends on the film type, deposition method, processing method, film thickness, size, shape, and substrate conditions.

Pattern design and data preparation

We design photomask pattern layouts and prepare GDS data based on your instructions for shapes, dimensions, and placement. The scope of work and verification methods are discussed according to your request.

Layout planning examples

Examples include pattern density, cross-sectional observation locations, and dummy pattern placement. These are considered to suit your desired structures and processing methods.

Source materials

Drawings, concept illustrations, rough sketches, dimension tables, and similar materials. If you have DXF or existing GDS data, we will review its contents.

Specifications to discuss

We discuss your desired shapes, dimensions, placement, scope of work, timing, and any known processing conditions. You can consult us before your specifications are finalized.

Delivery in GDSII format

We deliver GDS data (in GDSII format) describing pattern shapes and placement. This layout data serves as the basis for photomask production.

Mask production and wafer fabrication

For mask production and wafer fabrication following data preparation, see our Patterned Wafer Design & Fabrication service. Requests for GDS layout data preparation only can also be discussed.