Blanket Wafers & Thin Film Deposition

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Blanket Wafers & Thin Film Deposition

Blanket Wafers & Thin Film Deposition

BLANKET FILM WAFERS

Philtech provides deposition and plating services for semiconductor, insulating, metal, and other films, and supplies film-coated wafers.

We can handle everything from substrate sourcing to film deposition. You can also request just the deposition step in your manufacturing or development process while handling the preceding and subsequent steps yourself. Cutting after deposition is also available.

Film-coated wafers in a storage cassette

Discuss Your Blanket Wafer & Deposition Requirements

Applications of Blanket Wafers

Basic Etching, CMP & Cleaning EvaluationUnpatterned film-coated wafers are used for basic evaluation of etch rate, CMP removal rate, selectivity, removal characteristics, and related properties.
Film Thickness, Stress & Other PropertiesThese wafers serve as samples for studying the films themselves and measurement conditions, including film thickness, film stress, sheet resistance, and optical properties.
Electrode, Seed & Barrier Film EvaluationThese wafers are used to evaluate material films needed for subsequent processing, such as electrode films, plating seed layers, and diffusion barrier films.
Intentionally Warped Wafers for EvaluationFilm stress generated during deposition is used to create intentional wafer warpage for evaluation and experiments.
Comparing Film Materials & Film StacksWafers with different film materials or film stacks are prepared for material selection and comparative studies in research and development.

Substrates, Film Materials & Deposition Methods

Supported Substrates

Item	Details
Supported Substrate Sizes	4-inch (100 mm), 6-inch (150 mm), 8-inch (200 mm), 12-inch (300 mm)
Supported Substrate Materials	In addition to silicon wafers, we can process compound semiconductor wafers, quartz and glass substrates, ceramics, chips, rectangular substrates, and other substrates.

Film Materials & Deposition Methods

Category	Film Material	Deposition Method
Oxide Films	Th-SiO2	Thermal Oxidation
	P-SiO	PECVD
	ALD-SiO	ALD
	P-TEOS	PECVD
	LP-TEOS	LPCVD
	HDP	PECVD
	USG	PECVD
	PSG	CVD
	BPSG	CVD
Silicon Films	Poly-Si	LPCVD
Silicon Films	α-Si	PECVD
Nitride Films	LP-SiN	LPCVD
Nitride Films	P-SiN	PECVD
Carbon Films	α-C	PECVD
Carbon Films	SoC	Coating
Photoresist	I-Line	Coating
	KrF	Coating
	ArF	Coating
Low-k Films (SiOC)	BD	CVD
	AURORA	CVD
	CORAL	CVD
Metals & Other Materials	Ta, TaN	PVD
	Ti, TiN	PVD
	W, WN	PVD, CVD
	Cr	PVD
	Cu	PVD
	Al, Al-Cu, Al-Si	PVD
	Pt	PVD
	Ni	PVD
	Ru	PVD, CVD, ALD
	Au	PVD
	Mo, MoSi2, Mo2N, MoO	PVD
	Co	PVD, CVD, ALD
	SiGe, SiC, SiCN	PVD, CVD
	HfO2	PVD, ALD
	ZrO2	PVD, ALD
	AL2O3	PVD, ALD
Plating	Cu	Electroplating
	Ni	Electroplating
	Au	Electroplating
	SnAg	Electroplating
	AuSn	Electroplating
	In	Electroplating
	Rh	Electroplating

* PVD: sputtering, evaporation, ion plating, etc.

* In addition to plating on blanket films, patterned plating for bumps, interconnects, pads, and similar features is also available.

* Availability depends on the film material, deposition method, processing method, film thickness, size, geometry, and substrate conditions.

Information to Include in Your Inquiry

Please provide the wafer size and quantity, along with any other requirements you have determined. We will advise you on the available options based on your inquiry.

Item	Details
Application & Requirements	Evaluation objectives, intended applications, and your requirements
Film Material	Required film materials and deposition methods
Film Thickness	Required film thickness and tolerances
Substrate	Whether you will supply the substrates, or the required specifications if we are to provide them

Film Materials & Conditions Not Listed

Film materials and conditions not listed in the tables may also be possible, depending on the requirements. Please contact us with the details you have determined so far.