200mm Wafer for Plasma Damage Evaluation. Layout with mixed antenna sizes.
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Test Wafers
200mm Charge-up Monitor (YST)
300mm Charge-up Monitor (PT013)
300mm Wafer for Plasma Damage Evaluation. Layout with mixed antenna sizes.
Charge-up Monitor Chip YST
We can provide chips for plasma damage evaluation purposes. The layout will be the same as that of the wafer.
Hole & Trench Pattern Wafer (PT002)
We offer mixed layouts with holes ranging from 2µm to 100µm and trenches ranging from 2µm to 1000µm. Available on 200mm and 300mm wafers.
STI CMP Evaluation Wafer (PT004)
We can provide 300mm STI_CMP test wafers.
Cu CMP Evaluation Wafer (754)
We can provide 300mm Cu CMP test wafers. Trench sizes range from 0.18μm to 100μm.
Cu CMP Evaluation Wafer (CMP4)
We can provide 300mm Cu CMP test wafers with trench sizes ranging from 0.08μm to 100μm.
Poly-Si Pattern Wafer (PT005）
We can provide 300mm Poly-Si fine pattern wafers.
TSV Evaluation Wafer (PT007)
"200mm TSV Test Wafer. Layout includes holes ranging from 10µm to 30µm and trenches ranging from 2µm to 40µm.
High Aspect Ratio Trench Wafer (PT063)
We offer 200mm High Aspect Ratio Si Deep Trench Pattern Wafers. Chips are also available upon request.
Heat Beam Cylinder®
Heat Beam Cylinder Product Line
We have listed products available for sale.
Heat Beam Cylinder application example
We have described practical examples utilizing the HB units.
