Research Achievements

Wafers for 3D Stacking Development

Test Wafers

Feb 13, 2024

A direction for 3D integration by stacking wafers or chips on top of each other has been indicated. For the development of this technology, our company has designed and manufactured the necessary test wafers. Here is an example of such a wafer.

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Wafers for 3D Stacking Development

TSV Test Wafer : Mask （PT002）

TSV Test Wafer : Mask （PT012）

TSV Test Wafer : Mask （PT007）

Wafers for 3D Stacking Development

TSV Test Wafer : Mask （PT002）

TSV Test Wafer : Mask （PT012）

TSV Test Wafer : Mask （PT007）

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