An attempt to measure the speed of sound at ultra-low temperatures to determine the concentration of atomic vacancies in silicon wafers was made at Niigata University. Our company was responsible for manufacturing the SAW (Surface Acoustic Wave) devices needed for this purpose. A unique phenomenon of silicon softening near absolute zero due to the interaction of atomic vacancies was introduced in the paper.
Test Wafers
Research on Observing Atomic Vacancy Defects in Silicon Wafers
Feb 13, 2024
Test Wafers
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Wafers for 3D Stacking Development
Feb 13, 2024
Test Wafers
A direction for 3D integration by stacking wafers or chips on top of each other has been indicated. For the development of this technology, our company has designed and manufactured the necessary test wafers. Here is an example of such a wafer.
For more details, click here.
