Philtech TEG is the benchmark to test yield,processing, tools and material.
Hetero-crystal growth on off-axial substrate Technology Staff Profile

	Business Utilizing scientific knowledge and know how that is derived from decades of cutting edge semiconductor process development, Philtech Inc. started the business of providing fine-pattern test-wafers . These products include Cu interconnection wafers with damascene structure, contact resistance wafers, and ArF-immersion 22nm-featured wafers that meet stringent requirements of device manufacturers for benchmarking. We also provide blank silicon wafers, blanket film wafers, no defect MIT wafers and STI pattern wafers for CMP evaluation. We are supplying de-facto standard TSV pattern wafers that are essential for developing 3D and wafer stack processes to achieve ever-higher densities and performance levels. Our charge-damage 300mm-TEG and its measurement service to evaluate plasma damage is highly appraised by customers worldwide. The Fukushima nuclear plant accident in 2011 made us rethink what science and technology must do for future generations. The huge investments made to advance semiconductor process over past four decades have enriched our knowledge and understanding. We believe it was also an investment in our future, and we are committed to make it so. We first focused on enabling technology for low cost photovoltaic cell fabrication. We developed a tool (Heat Beam CVD) to continuously grow crystalline films like poly-silicon on a glass substrate or roll-to-roll steel sheet under ambient conditions. An air-isolated annealing tool technology, a derivative of Heat Beam, can be the printing technology for indispensable coating materials such as copper, transparent conducting films(ZnO), SOD for the large Flat-Panel-Display fabrication. We fabricated and exported a tool to grow crystal films for LED. At Philtech, we will convert scientific knowledge to value for the future generations.
(C)2002 Philtech Inc. all rights reserved.
このサイトの関連カテゴリ： フィルテック,フィルブリッジ,philtech,philbridge,半導体,富士通,ウエハ,ウエハー,微細パターン,加工ウエハ,製造装置,プロセス,シリコン,膜,メタル,高誘電体,低誘電体,強誘電体,古村雄二,X線 露光,X線リソ,パターン付きウェハ,微細加工,300mmウェハ,12インチウェハ,デバ イス試作,TEG,ナノテクノロジー,シリコン基板,半導体製造技術,半導体製造プロ セス,ウェハビジネス,テストウエハ,モニターウエハ,次世 代露光技術,NGL,成膜,各種成膜,philtech,philbridge,semiconductor,fujitsu,wafer,fine pattern,pattern wafer,equipment,process,silicon,film,metal,high-k,low-k,ferroelectric