Philtech TEG is the benchmark to test yield,processing, tools and material.
Technology Staff Profile

** News ** Film Hardness 8H is accomplished on coated polymer films by applying Heat Beam Technology on polycarbonate films.	Philtech Inc. business started providing test wafers with fine patterns. In order to well meet with device evaluation standard, Philtech Inc. provides wafers of Cu interconnection wafers in damascene structure, contact resistance wafers, and ArF-immersion 50nm-featured wafers. We also provide blank silicon wafers, blanket film wafers, no defect MIT wafers and STI pattern wafers for CMP evaluation together with water mark and poly-silicon falling wafers for cleaning evaluation. Further more We are supplying TSV wafers with various structures and standard patterns in 200mm and 300mm wafers answering technology concept change that is 3D or wafer stack for high-density and high-speed in semiconductor devices. Measurement with the standard Philtech charge-damage 300mm-TEG is gathering appreciation to probe the damage at a high sensitivity. We have developed a drastically concept-changing tool to deposit a crystalline film like silicon on glass or metal foil as a substrate. The tool is available to anneal plated films such as ZnO, CIGS, or SOD on glass or plastics, and improve their qualities of specific resistance, conduction type, or hardness, forming a flexible function sheet or layer. We offer a dry-etch gas of CF3I for fine pattern formation instead of CF4 that is an earth warming gas in semiconductor.
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